TAB IC Potting Machine Description

Product overview

This system is a reel-to-reel type potting device that facilitates dispensing and hardening of resin to protect the bonding of the bump and read and for tight compression after bonding (ILB) in the process of manufacturing LCD Driver IC (LDI).

Specification

Target Components: TCP, COF Tape Specifications: 35, 48,70mm(wide, super wide) Tape Thickness: 25 TO 125µm Potting Head: 4Head Application range: 80 x 80mm Tape positioning Accuracy: ± 10µm Pre-cure Oven: Program control Temperature: Room temperature to 200°C Tape Transport: Sprocket Tape Feed: Pulse Motor & Torque Motor Other Specifications Power Requirement: 220VAC, 3PHASE, 50/60Hz, 10Kva Outer Dimensions: 5995(W) * 820(D) * 1950(H) Weight: Approx 2450kg

Product feature

Potting capacity is 200% more than 2-head system Convenient touch panel using windows 2000 High precision potting with ± 0.005mm of robot accuracy Perfect needle calibration (patent pending) Multi type potting capable Minimized model change time-one touch model change Automatic potting pattern setting A perfect tape-feeding system (patent pending) Pre-cure temperature up to 200°C resist Pre-cure rail center-maintaining capability (patent pending) Strict ESD control

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