Polymide tape for semiconductors Description

Products Features

• This tape was developed for very precise operations involving attachment to the lead frame and transfer of film in a high heat, high pressure environment in the transfer process for semiconductors. Accordingly, the tape makes use of high technology by firmly fixing the film, and leaving no residue behind to pollute the process.

Products Specification

Grade No	Features and usage	Standard	Color
HKSI-2530	Used in the transfer process for circuit film and the lead frame. High heat and chemical resistance for optimum use in high heat, high pressure situations. Used in Micro-BGA, LF-BGA, and CSP processes. Can be used for heat resistant masking. Polyamide 25.50	According to user demand	Pumpkin
HKSI-2515
HKSI-5030
HKSI-5015

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