Lead Frame for IC Description
- Lead frames are one of 3 major parts of semiconductor package.
- The main role of the lead frame is to transfer the electrical signal between PCB board outside and semiconductor chip inside.
- Major users are the package companies such as Amkor, Chippac & Hynix.
Specifications
- Material: Cu alloy, A42, SPCC
- Thickness: 0.1 ~ 0.4 mm
- Tolerance: ± 0.025 mm
- Product function: base metal for semiconductor
- Second operation: Ag, Ni plating, bending press
Printable Lead Frame for IC, Imprinted,
Branded Lead Frame for ICPrinting, Printed Lead Frame for IC
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